Electronics Forum | Tue Sep 10 08:42:26 EDT 2013 | rway
Most of our product are mixed technology. I don't consider thru-hole components as "pesky." Perhaps from a manufacturing point of view they are due to the extra handling and machine requirements. But from a reliability stand-point, thru-hole is mu
Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala
Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu
Electronics Forum | Mon Sep 13 09:49:16 EDT 1999 | John Thorup
| | I noticed that some of our pcb's component legend/designation are unreadable as they are placed under smt pads. Is this correct and according to standard? Although we don't have any problems with them as of now, I would like to know the effects o
Electronics Forum | Tue Oct 26 15:44:35 EDT 2004 | Paul_pmd
Hi Mike, Surface mount components arn't difficult to work with at all. They have pretty much the same tolorance to heat degridation as Dip packages. I suggest two Irons when working with two pole resistors and caps. Heating only one end at a time wil
Electronics Forum | Thu May 19 05:25:54 EDT 2016 | buckcho
Hello, that's why some machines still use 2d for most of their algorithms and checks. They use the 3D on some special cases (like lifted leads). The full 3D machines are for me more complicated, because you can't use some simple 2d checks where appli
Electronics Forum | Thu Feb 27 15:14:53 EST 2020 | SMTA-Alex
This happens with either old tape, the cover tape doesn't stay sealed on the left side, or is the seal is too far to the right, the knife lifts the cover tape. There isn't much you can do in this case. Your choices are: switch the component into an A
Electronics Forum | Sat Jul 22 03:27:36 EDT 2023 | shrikant_borkar
hi here are consolidated inputs to you you must validate before establishing your process. ESD-safe Material: Ensure that the masking tape is made of ESD-safe materials that have low triboelectric charge generation. Common materials used in ESD-sa
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
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